| Layers | 1 - 4 |
| Material | FR-4 |
| Board Dimension (max) | 380mm X380mm |
| Board Dimension (min) | 10mm X10mm |
| Outline Dimension Accuracy | ± 0.2mm |
| Board Thickness | 0.40mm--2.0mm |
| Board Thickness Tolerance | ± 10% |
| Dielectric Separation thickness | 0.075mm--5.00mm |
| Conductor Width (min) | 0.15mm( Recommend>8mil ) |
| Conductor Space (min) | 0.15mm( Recommend>8mil) |
| Outer Conductor thickness | 35um |
| Inner Conductor thickness | 17um--100um |
| Copper to Edge | >0.3mm |
| Plated Component,Plated via Diameter(Mechanical) | 0.3mm--6.30mm |
| Plated Hole Diameter Tolerance(Mechanical) | 0.08mm |
| Unplated Hole Diameter Tolerance | 0.05mm |
| Hole Space(min) | 0.25mm |
| Hole to Edge | 0.4mm |
| Annular Ring(min) | 0.15mm |
| Aspect Ratio | 8:01 |
| Solder Resist Type | Photosensitive ink |
| Solder Resist Color | Black ,Green, White, Blue ,Yellow |
| Solder Resist Clearance | 0.1mm |
| Solder Resist Coverage | 0.1mm |
| Plug Hole Diameter | 0.3mm--0.65mm |
| Selective Finish | HASL, ENIG |
| Silkscreen line width (mim) | 6mil |
Note: Buried via and blind via are not supported.