Layers | 1 - 4 |
Material | FR-4 |
Board Dimension (max) | 380mm X380mm |
Board Dimension (min) | 10mm X10mm |
Outline Dimension Accuracy | ± 0.2mm |
Board Thickness | 0.40mm--2.0mm |
Board Thickness Tolerance | ± 10% |
Dielectric Separation thickness | 0.075mm--5.00mm |
Conductor Width (min) | 0.15mm( Recommend>8mil ) |
Conductor Space (min) | 0.15mm( Recommend>8mil) |
Outer Conductor thickness | 35um |
Inner Conductor thickness | 17um--100um |
Copper to Edge | >0.3mm |
Plated Component,Plated via Diameter(Mechanical) | 0.3mm--6.30mm |
Plated Hole Diameter Tolerance(Mechanical) | 0.08mm |
Unplated Hole Diameter Tolerance | 0.05mm |
Hole Space(min) | 0.25mm |
Hole to Edge | 0.4mm |
Annular Ring(min) | 0.15mm |
Aspect Ratio | 8:01 |
Solder Resist Type | Photosensitive ink |
Solder Resist Color | Black ,Green, White, Blue ,Yellow |
Solder Resist Clearance | 0.1mm |
Solder Resist Coverage | 0.1mm |
Plug Hole Diameter | 0.3mm--0.65mm |
Selective Finish | HASL, ENIG |
Silkscreen line width (mim) | 6mil |
Note: Buried via and blind via are not supported.